To successfully reflow or pull a BGA chip without warping the PCB, your software profile must meticulously pace the heating curves. Profile Phase Target Temp (Lead Solder) Target Temp (Lead-Free Solder) Ideal Ramp Rate Purpose of Phase 100°C – 120°C 120°C – 140°C 1.0°C – 1.5°C / sec Evaporates PCB moisture safely 2. Soak/Activation 140°C – 160°C 150°C – 180°C 1.0°C / sec Activates flux; stabilizes board 3. Reflow Ramp 183°C (Liquidus) 217°C (Liquidus) 1.5°C – 2.0°C / sec Pushes solder toward melting phase 4. Peak Reflow 210°C – 220°C 235°C – 245°C Hold for 20–40 sec Fully liquidizes spheres for bonding 5. Safe Cooling Decrease to room temp Decrease to room temp -2.0°C to -3.0°C / sec Solidifies joints without fracturing Essential Safety Settings for Daily Operation
Achi is a trademark of its respective owner. This article is for informational purposes. Always follow the manufacturer’s safety guidelines when measuring high-temperature surfaces.
Every time you successfully pull or seat a chip, save that specific software profile and name it after the board (e.g., "PS3_SYSCON_LeadFree"). achi ir6500 software hot
This comprehensive guide breaks down how to set up the ACHI IR6500 software interface, how to configure precise thermal zones, and how to troubleshoot common USB connection bugs to achieve industrial-grade soldering results. 🖥️ Essential Software Options for ACHI IR6500
The “hot” part of this keyword encompasses several overlapping issues that users experience with the IR6500 — many of which are software‑related but have hardware consequences. To successfully reflow or pull a BGA chip
If your reworking station is melting components or exceeding the programmed target temperatures, the root cause is usually split between software misconfiguration and hardware feedback loops. 1. Incorrect Thermocouple Calibration
Low emissivity setting on shiny objects. Fix: Adjust emissivity in software or on device. For polished metal, set emissivity to 0.3–0.5. Use black electrical tape on the target surface for accurate measurement. Reflow Ramp 183°C (Liquidus) 217°C (Liquidus) 1
If the software disconnects during a profile, it can cause the heat to run continuously. Check the USB cable and driver stability. A modification to the internal controller may be necessary for long-term reliability.